The industry in 2026
The footprint of a chip starts before the wafer fab
Strategic Accounts Manager at Minviro
Product carbon footprints from wafer to package
We map the materials, process steps, utilities and yield assumptions that shape a device footprint. That gives you a product-level result across wafer, die, assembly and packaging stages, with the detail needed to understand which inputs are driving the number.
Primary data from fabs and critical suppliers
Energy mix, process gas abatement, water treatment and chemical inputs can move the footprint more than a generic industry factor suggests. We help structure primary data from your sites and suppliers into a model that can be updated as the process changes.
Disclosure data your customers can use
Device makers and enterprise buyers increasingly need carbon data at component level. We produce transparent outputs with clear boundaries and methodology, so your customers can carry the result into their own product, Scope 3 and CSRD reporting.
